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Description
Super width conductive copper sheet is a high-purity material solution engineered for precision electronics and power distribution systems. Manufactured from C1100 electrolytic tough pitch (ETP) copper with 99.9% purity, it delivers electrical conductivity of ≥100% IACS and thermal conductivity of 398W/m·K, making it suitable for high-current and high-frequency applications. Its ultra-wide format, reaching up to 1350mm, eliminates the need for splicing in large-scale industrial projects. This design reduces joint resistance and potential failure points, improving the overall performance and stability of circuit boards, battery systems, and thermal management solutions. The material is produced with consistent manufacturing processes to meet the requirements of commercial procurement and industrial production workflows.
Parameter | Value |
Material | C1100 (99.9% purity) |
Width | 1000-1350mm |
Thickness | 0.1-10mm |
Length | 1000-8000mm |
Electrical Conductivity | ≥100% IACS |
Electrical Resistivity | ≤1.724μΩ·cm |
Thermal Conductivity | 398W/m·K |
Current Carrying Capacity | Up to 500A/mm² |
Surface Finish | Bright annealed, rolled |
Surface Roughness | Ra ≤0.8μm |
Minimum Order Quantity (MOQ) | 1000kgs-2000kgs |
C1100 copper exhibits electrical resistivity of ≤1.724μΩ·cm, which minimizes power loss during current transmission. This property is particularly beneficial for high-frequency circuits and power electronics, where efficient current flow directly impacts system energy efficiency. The material maintains consistent conductivity across a wide range of operating temperatures, supporting the demands of high-power industrial operations.
With a maximum width of 1350mm, these copper sheets enable the fabrication of large, single-piece components. This eliminates the need for multiple spliced sections, which can introduce additional resistance and potential failure points. Applications such as electric vehicle (EV) battery busbars and solar inverter panels benefit from this design, as it simplifies assembly processes and improves long-term system stability.
The thermal conductivity of 398W/m·K allows the material to rapidly transfer heat away from high-power components, including microprocessors and power transistors. Effective heat dissipation prevents component overheating, which can lead to performance degradation or premature failure. This feature makes the copper sheet suitable for high-power density systems used in industrial and renewable energy applications.
The bright annealed surface finish provides resistance to oxidation and tarnishing. This preserves the material's electrical conductivity in humid or industrial environments where moisture or airborne pollutants are present. The uniform surface also ensures consistent results during subsequent processing steps, such as etching, plating, and soldering.
Super width conductive copper sheet is used in the production of high-density interconnect (HDI) boards, server motherboards, and AI accelerator circuits. It serves as conductive traces and ground planes, supporting data transmission speeds up to 100Gbps. Its uniform grain structure enables precise photoetching of traces as narrow as 50μm, meeting the requirements of modern high-density electronic designs.
In power electronics, the material is utilized in EV battery packs, inverter modules, and wind and solar energy systems. Its high current carrying capacity of up to 500A/mm² supports efficient power distribution across large systems. The wide format allows for the production of continuous busbars and current collectors, reducing assembly complexity and improving energy efficiency.
Aerospace and defense applications, including radar systems, avionics, and satellite communication equipment, rely on this copper sheet for its high-frequency performance. It maintains signal integrity in the GHz range, which is critical for mission-critical operations. The material's stable mechanical and electrical properties under varying environmental conditions make it suitable for use in harsh aerospace environments.
Yes. Its uniform grain structure supports photoetching processes to create traces as narrow as 50μm. This capability makes it suitable for HDI PCBs and microelectronic components that require high-density circuit layouts.
It maintains stable performance in continuous use at temperatures up to 120°C. Short-term exposure to temperatures up to 250°C, such as during standard soldering processes, does not cause permanent degradation of its electrical or mechanical properties.
Yes. Its flat surface finish with a roughness value of Ra ≤0.8μm ensures strong adhesion with solder pastes and conductive adhesives commonly used in SMT assembly. This compatibility supports automated manufacturing workflows and consistent assembly quality.
