Super Width Conductive Copper Sheet for Circuits

Product Overview

The Super Width Conductive Copper Sheet is a high-purity material solution engineered for precision electronics and power distribution systems. Made from C1100 electrolytic tough pitch (ETP) copper—with 99.9% purity—it delivers industry-leading electrical conductivity (≥100% IACS) and thermal performance, making it indispensable for high-current, high-frequency applications. Its ultra-wide format (up to 1,350mm) eliminates the need for splicing in large-scale projects, reducing resistance and improving reliability in circuit boards, batteries, and heat management systems.

Product Specifications

Features

Ultra-High Conductivity: C1100 copper achieves low electrical resistivity (≤1.724μΩ·cm), minimizing power loss in high-frequency circuits and ensuring efficient current flow in power electronics.

Wide Format Capability: Sheets up to 1,350mm wide enable seamless fabrication of large components like EV battery busbars and solar inverter panels, reducing joint resistance and failure points.

Superior Thermal Management: With thermal conductivity of 398W/m·K, it rapidly dissipates heat from high-power components—such as microprocessors and power transistors—preventing overheating and extending service life.

Corrosion Resistance: A bright annealed surface finish resists oxidation and tarnishing, maintaining conductivity in humid or industrial environments where moisture or pollutants are present.

Applications

PCB Manufacturing: High-density interconnect (HDI) boards, server motherboards, and AI accelerator circuits use it for conductive traces and ground planes, supporting data transmission speeds up to 100Gbps.

Power Electronics: EV battery packs, inverter modules, and renewable energy systems leverage its high current-carrying capacity (up to 500A/mm²) for efficient power distribution.

Aerospace & Defense: Radar systems, avionics, and satellite communication equipment rely on its high-frequency performance (GHz range) and signal integrity in mission-critical applications.

FAQ

Q: Can it be etched for fine circuits?

A: Yes, its uniform grain structure supports photoetching for traces as narrow as 50μm, making it suitable for HDI PCBs and microelectronics.

Q: What is the maximum operating temperature?

A: It performs reliably in continuous use up to 120°C; short-term exposure to 250°C (e.g., during soldering) does not degrade properties.

Q: Is it compatible with surface mounting technology (SMT)?

A: Yes, its flat surface finish (Ra ≤0.8μm) ensures strong adhesion with solder pastes and conductive adhesives used in SMT assembly.